For IC wafer fabrication and packaging, PhiChem provides turnkey solutions of lithography, plating, etching, bonding and cleaning solutions.
Representative products include solder-paste, conformal coatings, liquid photoresists, photoresist developing, stripping and cleaning solutions, and etching & plating resist inks. Via PhiChem subsidiaries, we also offer a portfolio of epoxy molding compounds (EMC) and solder balls for IC device packaging. Technical data sheets of some of our representative products are provided below. Please contact us for specific information on products listed above, or to discuss a desired product that may not be listed.
Integrated Circuit (IC) Manufacturing Materials
Solutions for Integrated Circuit (IC) Manufacturing Materials
- IC Photoresist
- BARC (Bottom Anti-reflective Layer Coating)
- High-purity Wet Chemicals & Reagents
Wafer Level Packaging Materials
Wafer Level Packaging Materials
- Developers
- Strippers
- Etchants
- Plating Solutions
- Bonding Adhesives
- Cleaning Solutions
Chip Level Packaging Materials
Chip Level Packaging Materials
Epoxy Molding Compounds (EMC)
EMC are organic compounds mainly made of silica-filled epoxy resins and phenolic resins, that are used for packaging devices made on semiconductor wafers. By acquiring a 60% share in what was formerly Eternal Electronic Materials (Kunshan) Co., Ltd. (Eternal Electronic Materials), PhiChem has expanded its offerings in the electronics materials product category to include EMC. This new subsidiary of PhiChem, based in Kunshan, Jiangsu, China manufactures high-end EMC materials in standard, low stress and high thermal conductivity grades. Please check back for more information to be posted here on this PhiChem product-line or contact us for immediate assistance.
Solder Ball Products
Solder ball technology has been a key enabler for miniaturizing of semiconductor packages. With its recent acquisition of Kaohsiung, Taiwan-based PMTC as a wholly owned subsidiary, PhiChem can now offer a wide range of solder ball products for Ball Grid Array (BGA), Chip Scale Packaging (CSP) and other advanced packaging scheme for ICs. The PMTC product portfolio includes high-end solder balls with Tin-Lead (Sn-Pb), Lead-free and Indium-based compositions. Solder ball diameters range from 0.075mm to 0.76mm and are available in standard, low-temperature, high-temperature and high-purity grades. Please check back for more information to be posted here on this PhiChem product-line or contact us for immediate assistance.
Printed Wiring Board (PWB) Fabrication Materials
Printed Wiring Board (PWB) Fabrication Materials
Etching and Plating Resist Ink
PhiChem supplies high-performance etching and plating resist inks for PWB fabrication, that have high-resolution capability and provide high-yields.